Applied Reseach & Photonics, Inc. (ARP) provides terahertz nano-scanning material characterization and testing services that helps semiconductor and nanomaterial researchers and manufacturers, easily visualize and identify in 3-Dimensional images, surface, sub-layer defects and failures. ARP testing is non-contact, non-distructive and performed at ambient temperatures.
ARP’s Terahertz Scanning Spectrometer (TeraSpectra) is a Terahertz Nano-Scanning Spectrometer/3D Imaging system that has two key technology innovations:
1) it breaks the spatial resolution limit of current generation optical inspection technologies, and
2) it uniquely identifies location and depth where defects exist.
Currently, there is no measurement technology that has the capability to provide an equivalent richness of information that ARP’s TeraSpectra system can deliver without damage or destruction of the test sample.
Atomic Force Microscopes (AFM) are one of the go-to technologies for wafer inspection, but require surface contact which can damage nanometer scale circuits. X-Ray inspection technology imparts high energies which can damage substrate lattice structure. IR inspection technologies at wavelengths of 1.5 microns and UV inspection at 256 nanometers, which are the current state of the art, but are limited to surface inspection only. Electron Microscopes are very expensive, require sample destruction and tedious sample preparation.
Once material samples are received test duration is typically between 1 and 3 days per sample. Test duration, as always, are subject to the test criteria and characterization requirements of our customers. ARP consultants provide a comprehensive test report and assist in interpretation of results.