ARP announces terahertz nano-scanner for sub-surface inspection and 3D imaging

Main features

A paper for wafer inspection is here:

Effective testing for wafer reject minimization by terahertz analysis and sub-surface imaging

Surface plot of a patterned wafer reveals problem areas.
Layer-by-layer inspection is done for inspecting each layer individually. See the video clip.

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For pricing and availability please contact:

Applied Research & Photonics, Inc.
470 Friendship Road, Suite 10
Harrisburg, PA 17111

Phone: 717-220-1003
Fax: 717-566-1177